Subscribe!
eNewsletter
Magazines
About Us
|
Advertise
|
Contact Us
|
Site Map
eNewsletter
Magazines
About Us
|
Advertise
|
Contact Us
|
Site Map
Top
|
||
Solid State Technology Resource GuideCompany Profile Nextreme
Description: Nextreme Thermal Solutions designs and manufactures microscale thermal and power management products for the semiconductor, photonics, consumer, automotive and defense/aerospace industries. The company has embedded cooling, temperature control and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging. Nextremeâ?Ts breakthrough addresses the most challenging thermal and power management constraints in electronics today, and delivers the only fully-scalable technology solution by leveraging the existing, high-volume flip chip manufacturing infrastructure. By minimizing the need for manufacturing changes and focusing on developing a seamless design-in solution, Nextreme will change the future of thermal and power management for the entire electronics industry. Product CategoriesThis company appears in the following product categories: |
||
|
Top
|
- Subscribe:
- newsletters |
- Magazines |
- About Us |
- Advertise |
- Contact Us |
- Site Map |
- Webmaster
- Copyright © 2007: PennWell Corporation, Tulsa, OK; All Rights Reserved. |
- Privacy Policy |
- Terms & Conditions
- Site Topics:
- Home |
- Technology |
- Applications |
- Multimedia |
- Resources |
- Resource Guide |
- Blogs |
- Events |
- WaferNews Financial Markets |
- Jobs
