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Solid State Technology Resource GuideCompany Profile TLMI Corp
Key Personnel: Pres/CEO/CTO:
Leif Fredin Description: Provides wafer bumping for flip chip; prototyping, mask design, test devices, and redistribution layers. Bump materials: gold, copper, indium, solder of various compositions. Low volume production. Product CategoriesThis company appears in the following product categories: |
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