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Solid State Technology Resource GuideCompany Profile Finetech Inc
Key Personnel: Gen Mgr:
Chris Underhill Description: Supplies precision die bonders and lead-free rework systems. Die bonders for IC's, opto, MEMs and flip chip - capable of thermocompression, thermosonic, eutecic, expoxy, ACF and Indium bonding. Rework systems handle the complete rework process for the basic component repair to advanced technologies. Product CategoriesThis company appears in the following product categories: |
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