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Solid State Technology Resource Guide

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Company Profile

Finetech Inc

8380 S Kyrene Rd
Suite 110
Tempe, AZ 85284
Phone: 480-893-1630
Fax: 480-893-1630
Email: salse@finetechusa.com
Key Personnel: Gen Mgr: Chris Underhill
Description: Supplies precision die bonders and lead-free rework systems. Die bonders for IC's, opto, MEMs and flip chip - capable of thermocompression, thermosonic, eutecic, expoxy, ACF and Indium bonding. Rework systems handle the complete rework process for the basic component repair to advanced technologies.

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