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Solid State Technology Resource GuideCompany Profile NEXX Systems
Key Personnel: CEO/Chmn:
Richard Post Description: Provides efficient, yet affordable process solutions, specially designed for flip-chip and advanced packaging. High-throughput sputtering system deposits multiple layers for under-bump metallization, backside metallization, and redistribution and integrated passives. High-throughput, electro-deposition system integrates process advantages of thin-boundary layer deposition with the economic advantages of parallel processing. Product CategoriesThis company appears in the following product categories: |
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