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Solid State Technology Resource GuideCompany Profile NEPTCO
Key Personnel: Bus Unit Mgr:
Tom Auger Description: Manufactures Wafertape UV and pressure-sensitive films for wafer dicing, which are designed to ensure consistent, precise, and repeatable wafer-production yields. Coating technology encompasses total thickness variation (TTV) control, expandable base film, and a special low-extractable release liner, which reduces silicon residue by a significant margin. Product CategoriesThis company appears in the following product categories: |
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