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Solid State Technology Resource GuideCompany Profile III/V-Reclaim
Description: Offers reclaim (recycling) of GaAs and InP wafers. Removes all layers (structured or nonstructured), all metallizations, as well as implanted, epitaxial, and protective layers. All formats and sizes can be handled. Manufactures thin wafers of 50µm. Offers single-side and double-side polishing and ready-to-use surface treatment. Product CategoriesThis company appears in the following product categories: |
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