Description: Offers precision bonders for MEMS, surface-mount photonics, laser bars/diodes, VCSELs, sensors and flip chips. Thermo-compression, thermo-sonic, eutectic, epoxy, ACF and Indium bonding. Process flexibility is ideal for R&D or prototyping. The Fineplacer Lambda bonder (+/- 0.5 micron placement accuracy) is the pathway to Finetech's fully-automated, submicron accuracy FEMTO.