Key Personnel: Pres: Karl Loh

Description: Manufactures adhesives and encapsulants for electronics and optoelectronics assembly. Products include electrically conductive adhesives, thermally conductive adhesives, ultralow stress adhesives, anisotropically conductive adhesives, UV curable, glob top encapsulants, underfill encapsulants for flip chips, CSPs, and BGAs, including reworkable underfill encapsulants.